Dr. Lee's research activities include thermal management, 3-D packaging, self-aligning soldering, fluxless flip-chip connections, optoelectronics packaging, process control, microelectromechanical systems (MEMS), nanoelectromechanical systems (NEMS),and microfluidic devices. In particular, his recent research activities focus on: 1) flexible thermal ground planes for smartphones, tablets, laptops, AR/VR and wearable electronics; 2) micro cryogenic coolers for mobile sensors; and 3) microfluidic devices for culture, dose and lyse biological cells affected by molecules.
keywords
packaging for system integration, nanotechnology, microsystems, microelectromechanical systems, nanoelectromechanical systems, cryocoolers,thermal management, sensors, actuators, smartphones, microfluidic devices
