Micromesh-Enabled Low-Cost Thermal Ground Planes for High Heat Flux Power Electronics Conference Proceeding

Overview

CU Boulder Authors

Lee, Y. C.

publication date

May 29, 2018

has restriction

closed

Date in CU Experts

February 4, 2019 11:26 AM

Full Author List

Xu S; Lewis RJ; Wen R; Yang R; Lee Y-CYC; Kim W; Nguyen L

author count

7

citation count

6

published in

Electronic Components and Technology Conference Journal

presented at event

68th IEEE Electronic Components and Technology Conference (ECTC) Conference

Other Profiles

International Standard Serial Number (ISSN)

0569-5503

Electronic International Standard Serial Number (EISSN)

2377-5726

Digital Object Identifier (DOI)

https://doi.org/10.1109/ectc.2018.00338

Additional Document Info

start page

2248

end page

2253