publication venue for

• Soldering technology for optoelectronic packaging 1996
• Micromesh-Enabled Low-Cost Thermal Ground Planes for High Heat Flux Power Electronics 2018
• Prediction of fatigue crack initiation between underfill epoxy and substrate 2000
• Study of micro-scale limits of solder self-assembly for MEMS 2000
• Reliability study of an epoxy-bonded laser-to-fiber assembly 1998
Thermosonic flip chip bonding system with a self-planarization feature using polymer 1998
Controlled solder self-alignment sequence for an optoelectronic module without mechanical stops 1997
Efficient design using fuzzy logic based regression models 1997
Gas flow effects on precision solder self-alignment 1997
Polymer tapered waveguides and flip-chip solder bonding as compatible technologies for efficient OEIC coupling 1997
The effect of underfill epoxy on mechanical behavior of flip chip assembly 1997
Thermosonic flip-chip bonding using longitudinal ultrasonic vibration 1997
THERMAL MANAGEMENT OF VCSEL-BASED OPTOELECTRONIC MODULES 1995
THERMOSONIC FLIP-CHIP BONDING FOR AN 8X8 VCSEL ARRAY 1995
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