publication venue for
- Soldering technology for optoelectronic packaging 1996
- Micromesh-Enabled Low-Cost Thermal Ground Planes for High Heat Flux Power Electronics 2018
- Prediction of fatigue crack initiation between underfill epoxy and substrate 2000
- Study of micro-scale limits of solder self-assembly for MEMS 2000
- Reliability study of an epoxy-bonded laser-to-fiber assembly 1998
- Thermosonic flip chip bonding system with a self-planarization feature using polymer 1998
- Controlled solder self-alignment sequence for an optoelectronic module without mechanical stops 1997
- Efficient design using fuzzy logic based regression models 1997
- Gas flow effects on precision solder self-alignment 1997
- Polymer tapered waveguides and flip-chip solder bonding as compatible technologies for efficient OEIC coupling 1997
- The effect of underfill epoxy on mechanical behavior of flip chip assembly 1997
- Thermosonic flip-chip bonding using longitudinal ultrasonic vibration 1997
- THERMAL MANAGEMENT OF VCSEL-BASED OPTOELECTRONIC MODULES 1995
- THERMOSONIC FLIP-CHIP BONDING FOR AN 8X8 VCSEL ARRAY 1995