The effect of underfill epoxy on mechanical behavior of flip chip assembly Conference Proceeding uri icon

Overview

publication date

  • May 18, 1997

has restriction

  • closed

Date in CU Experts

  • May 28, 2014 4:03 AM

Full Author List

  • Zhang WG; Wu D; Su BZ; Hareb S; Lee YC; Masterson P

author count

  • 6

citation count

  • 1

Other Profiles

International Standard Serial Number (ISSN)

  • 0569-5503

Electronic International Standard Serial Number (EISSN)

  • 2377-5726

International Standard Book Number (ISBN) 10

  • 0-7803-3858-8

Additional Document Info

start page

  • 1170

end page

  • 1175