Prediction of fatigue crack initiation between underfill epoxy and substrate Conference Proceeding

Overview

CU Boulder Authors

Lee, Y. C.

publication date

May 21, 2000

has restriction

closed

Date in CU Experts

May 28, 2014 4:03 AM

Full Author List

Wu D; Su BZ; Lee YC; Dunn ML

author count

4

citation count

1

published in

Electronic Components and Technology Conference Journal

presented at event

50th Electronic Components & Technology Conference (ECTC 01) Conference

Other Profiles

International Standard Serial Number (ISSN)

0569-5503

Electronic International Standard Serial Number (EISSN)

2377-5726

Digital Object Identifier (DOI)

https://doi.org/10.1109/ectc.2000.853227

International Standard Book Number (ISBN) 10

0-7803-5908-9

Additional Document Info

start page

646

end page

649