THERMOSONIC FLIP-CHIP BONDING FOR AN 8X8 VCSEL ARRAY Conference Proceeding

Overview

CU Boulder Authors

• Lee, Y. C.

publication date

• May 21, 1995

Date in CU Experts

• May 28, 2014 4:03 AM

Full Author List

• MCLAREN T; KANG SY; ZHANG WG; HELLMAN D; JU TH; LEE YC

author count

• 6

citation count

• 5

published in

• Electronic Components and Technology Conference  Journal

presented at event

• 45th Electronic Components and Technology Conference  Conference

Other Profiles

International Standard Serial Number (ISSN)

• 0569-5503

Electronic International Standard Serial Number (EISSN)

• 2377-5726

International Standard Book Number (ISBN) 10

• 0-7803-2737-3

Additional Document Info

start page

• 393

end page

• 400