Thermosonic flip chip bonding system with a self-planarization feature using polymer Conference Proceeding uri icon

Overview

publication date

  • May 25, 1998

has restriction

  • closed

Date in CU Experts

  • May 28, 2014 4:03 AM

Full Author List

  • Tan Q; Schaible B; Bond LJ; Lee YC

author count

  • 4

citation count

  • 4

Other Profiles

International Standard Serial Number (ISSN)

  • 0569-5503

Electronic International Standard Serial Number (EISSN)

  • 2377-5726

International Standard Book Number (ISBN) 10

  • 0-7803-4526-6

Additional Document Info

start page

  • 1318

end page

  • 1325