Polymer tapered waveguides and flip-chip solder bonding as compatible technologies for efficient OEIC coupling Conference Proceeding uri icon

Overview

publication date

  • May 18, 1997

Date in CU Experts

  • May 28, 2014 3:11 AM

Full Author List

  • Goodwill DJ; Fan RS; Hooker RB; Lee YC; McComas BL; Mickelson AR; Morozova ND; Tomic D

author count

  • 8

citation count

  • 1

Other Profiles

International Standard Serial Number (ISSN)

  • 0569-5503

Electronic International Standard Serial Number (EISSN)

  • 2377-5726

International Standard Book Number (ISBN) 10

  • 0-7803-3858-8

Additional Document Info

start page

  • 788

end page

  • 796