Soldering technology for optoelectronic packaging Chapter

Overview

CU Boulder Authors

• Lee, Y. C.

publication date

• January 1, 1996

has restriction

• closed

Date in CU Experts

• December 17, 2013 12:58 PM

Full Author List

• Tan Q; Lee YC

Full Editor List

• Tummala RR

author count

• 2

citation count

• 24

published in

• Electronic Components and Technology Conference  Journal

Other Profiles

Digital Object Identifier (DOI)

• https://doi.org/10.1109/ectc.1996.517371

International Standard Book Number (ISBN) 10

• 0-7803-3286-5

Additional Document Info

start page

• 26

end page

• 36