STUDIES OF THERMOSONIC BONDING FOR FLIP-CHIP ASSEMBLY Journal Article

Overview

CU Boulder Authors

• Lee, Y. C.

publication date

• October 1, 1995

has restriction

• closed

Date in CU Experts

• September 6, 2013 12:41 PM

Full Author List

• KANG SY; WILLIAMS PM; MCLAREN TS; LEE YC

author count

• 4

citation count

• 57

published in

• Materials Chemistry and Physics  Journal

Other Profiles

International Standard Serial Number (ISSN)

• 0254-0584

Electronic International Standard Serial Number (EISSN)

• 1879-3312

Digital Object Identifier (DOI)

• https://doi.org/10.1016/0254-0584(95)80039-5

Additional Document Info

start page

• 31

end page

• 37

volume

• 42

issue

• 1