The effect of underfill epoxy on warpage in flip-chip assemblies Journal Article uri icon

Overview

publication date

  • June 1, 1998

has restriction

  • closed

Date in CU Experts

  • September 6, 2013 12:41 PM

Full Author List

  • Zhang WG; Wu D; Su BZ; Hareb SA; Lee YC; Masterson BP

author count

  • 6

citation count

  • 36

Other Profiles

International Standard Serial Number (ISSN)

  • 1070-9886

Additional Document Info

start page

  • 323

end page

  • 329

volume

  • 21

issue

  • 2