Thermal and Structural Analysis of a Suspended Physics Package for a Chip-Scale Atomic Clock Journal Article

Overview

CU Boulder Authors

Lee, Y. C.

publication date

December 1, 2009

has restriction

closed

Date in CU Experts

September 6, 2013 12:40 PM

Full Author List

Laws AD; Borwick R; Stupar P; DeNatale J; Lee YC

author count

5

citation count

9

published in

Journal of Electronic Packaging Journal

Other Profiles

International Standard Serial Number (ISSN)

1043-7398

Electronic International Standard Serial Number (EISSN)

1528-9044

Digital Object Identifier (DOI)

https://doi.org/10.1115/1.4000211

Additional Document Info

volume

131

issue

4

number

ARTN 041005