Foreword - Special issue on MEMS/NEMS packaging Journal Article

Overview

CU Boulder Authors

• Lee, Y. C.

publication date

• August 1, 2003

has restriction

• closed

Date in CU Experts

• September 6, 2013 12:41 PM

Full Author List

• Lee YC; Chiou JA; Chen SC; Jung E

author count

• 4

citation count

• 1

published in

• IEEE Transactions on Advanced Packaging  Journal

Other Profiles

International Standard Serial Number (ISSN)

• 1521-3323

Digital Object Identifier (DOI)

• https://doi.org/10.1109/tadvp.2003.817823

Additional Document Info

start page

• 215

end page

• 216

volume

• 26

issue

• 3