Die cracking at solder (NO-PNO) joints on brittle (GaAs) chips: Fracture correlation using critical bimaterial interface corner stress intensities Journal Article uri icon

Overview

publication date

  • September 1, 2003

has restriction

  • closed

Date in CU Experts

  • September 3, 2013 12:43 PM

Full Author List

  • Su BZ; Lee YC; Dunn ML

author count

  • 3

citation count

  • 1

Other Profiles

International Standard Serial Number (ISSN)

  • 1043-7398

Electronic International Standard Serial Number (EISSN)

  • 1528-9044

Additional Document Info

start page

  • 369

end page

  • 377

volume

  • 125

issue

  • 3