Yield prediction for flip-chip solder assemblies based on solder shape modeling Journal Article uri icon

Overview

publication date

  • January 1, 1999

has restriction

  • closed

Date in CU Experts

  • December 17, 2013 9:03 AM

Full Author List

  • Tower SC; Bingzhi Su; Lee YC

author count

  • 3

Other Profiles

International Standard Serial Number (ISSN)

  • 1521-334X

Additional Document Info

start page

  • 29

end page

  • 37

volume

  • 22

issue

  • 1