RF and mechanical characterization of flip-chip interconnects in CPW circuits with underfill Journal Article uri icon

Overview

publication date

  • December 1, 1998

has restriction

  • closed

Date in CU Experts

  • September 6, 2013 12:41 PM

Full Author List

  • Feng ZP; Zhang WG; Su BZ; Gupta KC; Lee YC

author count

  • 5

citation count

  • 45

Other Profiles

International Standard Serial Number (ISSN)

  • 0018-9480

Electronic International Standard Serial Number (EISSN)

  • 1557-9670

Additional Document Info

start page

  • 2269

end page

  • 2275

volume

  • 46

issue

  • 12