Thermal and structural analysis of a suspended physics package for a chip-scale atomic clock
Conference Proceeding
Overview
publication date
- July 8, 2007
Date in CU Experts
- May 28, 2014 4:03 AM
Full Author List
- Laws AD; Lee YC
author count
- 2
presented at event
- ASME InterPACK Conference Conference
Other Profiles
International Standard Book Number (ISBN) 13
- 978-0-7918-4277-5
Additional Document Info
start page
- 953
end page
- 962