SOLDER ENGINEERING FOR OPTOELECTRONIC PACKAGING
Journal Article
Overview
publication date
- June 1, 1994
Date in CU Experts
- September 6, 2013 12:41 PM
Full Author List
- LEE YC; BASAVANHALLY N
author count
- 2
citation count
- 11
published in
- Journal of Metals Journal
Other Profiles
International Standard Serial Number (ISSN)
- 1047-4838
Additional Document Info
start page
- 46
end page
- 50
volume
- 46
issue
- 6