abstract
- This book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging including: New bonding and joining techniques Novel approaches to make ...
Microelectromechanical Systems and Packaging
Chapter
Overview
CU Boulder Authors
publication date
- December 17, 2008
Date in CU Experts
- December 17, 2013 12:56 PM
Full Author List
- lee Y
Full Editor List
- Lu D; Wong CP
author count
- 1
Other Profiles
International Standard Book Number (ISBN) 10
- 0387782192
International Standard Book Number (ISBN) 13
- 9780387782195