Study of fluxless soldering using formic acid vapor Journal Article

Overview

CU Boulder Authors

• Lee, Y. C.

publication date

• November 1, 1999

has restriction

• closed

Date in CU Experts

• September 6, 2013 12:40 PM

Full Author List

• Lin W; Lee YC

author count

• 2

citation count

• 55

published in

• IEEE Transactions on Advanced Packaging  Journal

Other Profiles

International Standard Serial Number (ISSN)

• 1521-3323

Digital Object Identifier (DOI)

• https://doi.org/10.1109/6040.803451

Additional Document Info

start page

• 592

end page

• 601

volume

• 22

issue

• 4