Random change of vibration modes in thermosonic bonding Journal Article

Overview

CU Boulder Authors

• Lee, Y. C.

publication date

• September 1, 1998

has restriction

• closed

Date in CU Experts

• September 6, 2013 12:40 PM

Full Author List

• Kang SY; Chuang K; Lee YC

author count

• 3

published in

• Journal of Electronic Packaging  Journal

Other Profiles

International Standard Serial Number (ISSN)

• 1043-7398

Digital Object Identifier (DOI)

• https://doi.org/10.1115/1.2792630

Additional Document Info

start page

• 253

end page

• 258

volume

• 120

issue

• 3