Design of Thermal Ground Planes for Cooling of Foldable Smartphones Journal Article uri icon

Overview

publication date

  • June 1, 2019

has restriction

  • closed

Date in CU Experts

  • May 29, 2019 11:08 AM

Full Author List

  • Nematollahisarvestani A; Lewis RJ; Lee Y-C

author count

  • 3

citation count

  • 4

Other Profiles

International Standard Serial Number (ISSN)

  • 1043-7398

Electronic International Standard Serial Number (EISSN)

  • 1528-9044

Additional Document Info

volume

  • 141

issue

  • 2

number

  • ARTN 021004