Broadband RF Interconnects in a Multi-Layer Advanced Packaging with a Si Interposer Conference Proceeding
Overview
publication date
- October 15, 2023
Date in CU Experts
- January 3, 2024 6:50 AM
Full Author List
- Mvokany S; Molles J; Popovic Z
author count
- 3
citation count
- 0
presented at event
Other Profiles
International Standard Serial Number (ISSN)
- 2165-4107