Liquid phase sintered Cu-In composite solders for thermal interface material and interconnect applications Journal Article uri icon

Overview

publication date

  • November 1, 2011

has restriction

  • closed

Date in CU Experts

  • September 6, 2013 12:43 PM

Full Author List

  • Liu J; Kumar P; Dutta I; Raj R; Sidhu R; Renavikar M; Mahajan R

author count

  • 7

citation count

  • 18

Other Profiles

International Standard Serial Number (ISSN)

  • 0022-2461

Electronic International Standard Serial Number (EISSN)

  • 1573-4803

Additional Document Info

start page

  • 7012

end page

  • 7025

volume

  • 46

issue

  • 21