Liquid Phase Sintered Solders with Indium as Minority Phase for Next Generation Thermal Interface Material Applications Journal Article uri icon

Overview

publication date

  • December 1, 2009

has restriction

  • closed

Date in CU Experts

  • September 6, 2013 12:43 PM

Full Author List

  • Dutta I; Raj R; Kumar P; Chen T; Nagaraj CM; Liu J; Renavikar M; Wakharkar V

author count

  • 8

citation count

  • 26

Other Profiles

International Standard Serial Number (ISSN)

  • 0361-5235

Electronic International Standard Serial Number (EISSN)

  • 1543-186X

Additional Document Info

start page

  • 2735

end page

  • 2745

volume

  • 38

issue

  • 12