Alumina Passives Using the Interconnect Layer of Metal-Embedded Chip Assembly Processing Conference Proceeding uri icon

Overview

publication date

  • December 12, 2018

Date in CU Experts

  • January 31, 2020 2:01 AM

Full Author List

  • Estrada J; Lasser G; Pinto M; Herrault F; Popovi Z

author count

  • 5