Atomic layer deposition for high aspect ratio through silicon vias Journal Article
Overview
publication date
- July 1, 2013
has restriction
- closed
Date in CU Experts
- December 18, 2018 4:31 AM
Full Author List
- Knaut M; Junige M; Neumann V; Wojcik H; Henke T; Hossbach C; Hiess A; Albert M; Bartha JW
author count
- 9
citation count
- 30
published in
- Microelectronic Engineering Journal
Other Profiles
International Standard Serial Number (ISSN)
- 0167-9317
Electronic International Standard Serial Number (EISSN)
- 1873-5568
Digital Object Identifier (DOI)
Additional Document Info
start page
- 80
end page
- 83
volume
- 107