publication venue for
- 3D system integration on 300 mm wafer level: High-aspect-ratio TSVs with ruthenium seed layer by thermal ALD and subsequent copper electroplating 2019
- In-situ analysis on the initial growth of ultra-thin ruthenium films with atomic layer deposition 2013
- Atomic layer deposition for high aspect ratio through silicon vias 2013
- Evolution of stress gradients in Cu films and features induced by capping layers 2012
- Comparison of PVD, PECVD & PEALD Ru(-C) films as Cu diffusion barriers by means of bias temperature stress measurements 2011
- Process development in metal/BCB multilayer interconnections of MMCM with embedded chip in Si substrate 2009
- Microstructure and dielectric response of SrTiO3/NdGaO3 interdigitated capacitors 2008