Wafer-level multilayer integration of RF passives with thick BCB/metal interlayer connection in silicon-based SiP Journal Article uri icon

Overview

publication date

  • January 1, 2012

has restriction

  • closed

Date in CU Experts

  • January 20, 2017 1:03 AM

Full Author List

  • Tang J; Ding X; Geng F; Sun X; Luo L

author count

  • 5

citation count

  • 4

Other Profiles

International Standard Serial Number (ISSN)

  • 0946-7076

Electronic International Standard Serial Number (EISSN)

  • 1432-1858

Additional Document Info

start page

  • 119

end page

  • 126

volume

  • 18

issue

  • 1