A SYSTEM APPROACH TO DESIGN AND PROCESSING OF CERAMIC SUBSTRATES FOR ELECTRONIC PACKAGING Journal Article uri icon

Overview

publication date

  • July 1, 1988

Date in CU Experts

  • December 3, 2015 1:28 AM

Full Author List

  • RAJ R

author count

  • 1

Other Profiles

International Standard Serial Number (ISSN)

  • 0148-6608

Additional Document Info

start page

  • A19

end page

  • A19

volume

  • 40

issue

  • 7