The socket response to current packaging and test trends Conference Proceeding

Overview

CU Boulder Authors

Bogatin, Eric

publication date

July 14, 2004

has restriction

closed

Date in CU Experts

February 13, 2024 7:04 AM

Full Author List

Andes J; Bogatin E

author count

2

citation count

2

published in

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium Journal

presented at event

29th International Electronics Manufacturing Technology Symposium Conference

Other Profiles

International Standard Serial Number (ISSN)

1089-8190

Digital Object Identifier (DOI)

https://doi.org/10.1109/iemt.2004.1321639

International Standard Book Number (ISBN) 10

0-7803-8582-9

Additional Document Info

start page

97

end page

99