publication date
- December 3, 2012
Mitigating residual stress in Cu metallization
Journal Article
Overview
has restriction
- closed
Date in CU Experts
- November 5, 2020 2:39 AM
Full Author List
- Murray CE; Jordan-Sweet J; Ryan ET; Toney MF
author count
- 4
citation count
- 4
published in
- Applied Physics Letters Journal
Other Profiles
International Standard Serial Number (ISSN)
- 0003-6951
Digital Object Identifier (DOI)
Additional Document Info
volume
- 101
issue
- 23
number
- ARTN 231906