Stress Evolution in Sn Thin Films During Thermal Cycling
Conference Proceeding
Overview
publication date
- February 8, 2009
Date in CU Experts
- November 5, 2020 2:39 AM
Full Author List
- Stevens KJ; Cheong KC; Cai Z; Ingham B; Toney MF
Full Editor List
- Hendy SC; Brown IWM
author count
- 5
citation count
- 0
published in
- AIP Conference Proceedings Journal
presented at event
Other Profiles
International Standard Serial Number (ISSN)
- 0094-243X
International Standard Book Number (ISBN) 13
- 978-0-7354-0688-9
Additional Document Info
start page
- 141
end page
- +
volume
- 1151