publication venue for
- Compact 3-D Printed Bandpass Filters Using Folded Mixed Hemispherical Resonators 2023
- Miniaturized Monolithic 3-D Printed Bandpass Filters Using Nested Spherical Resonators 2023
- Glass-Based Bandpass Filters for New Radio (NR) K-/Ka-Band Communications 2022
- Thermal Design, Optimization, and Packaging of Planar Magnetic Components 2021
- Development and Experimental Validation of a 3-D Solder Self-Alignment Model for Alignment Accuracy Prediction of Flip-Chip Assembly 2011
- Differential Via Modeling Methodology 2011